X-ray inspection of electronic components

X-ray inspection can detect foreign particles, contaminants, or residues on or in components that may have resulted from improper cleaning or processing.  

Delamination is a separation or detachment of layers within a component. X-ray inspection can detect such internal structural problems. 

X-ray inspection can determine if chip components are properly positioned and aligned on the PC

X-ray inspection can ensure that the correct components are placed in the appropriate mounting positions.  

X-ray inspection can look for cracks, breaks or structural defects caused by mechanical stress or material fatigue.  

X-ray testing can detect inclusions or air pockets in solder joints that can compromise electrical or mechanical integrity.  

X-ray inspection can detect faulty traces or damage to traces that could affect component functionality. 

X-ray inspection allows examination of the internal structure of components such as integrated circuits (ICs) or transistors to ensure they meet specified design requirements.